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Zastosuj identyfikator do podlinkowania lub zacytowania tej pozycji: http://hdl.handle.net/20.500.12128/3319
Tytuł: Surface morphology of titanium nitride thin films synthesized by DC reactive magnetron sputtering
Autor: Ţǎlu, Ştefan
Stach, Sebastian
Valedbagi, Shahoo
Elahi, Mohammad S.
Bavadi, Reza
Słowa kluczowe: Fractal analysis; Surface roughness; Titanium nitride (TiN) thin film; DC reactive magnetron sputtering; Atomic force microscopy
Data wydania: 2015
Źródło: Materials Science-Poland, 2015, iss. 1, s. 137-143
Abstrakt: In this paper the influence of temperature on the 3-D surface morphology of titanium nitride (TiN) thin films synthesized by DC reactive magnetron sputtering has been analyzed. The 3-D morphology variation of TiN thin films grown on p-type Si (100) wafers was investigated at four different deposition temperatures (473 K, 573 K, 673 K, 773 K) in order to evaluate the relation among the 3-D micro-textured surfaces. The 3-D surface morphology of TiN thin films was characterized by means of atomic force microscopy (AFM) and fractal analysis applied to the AFM data. The 3-D surface morphology revealed the fractal geometry of TiN thin films at nanometer scale. The global scale properties of 3-D surface geometry were quantitatively estimated using the fractal dimensions D, determined by the morphological envelopes method. The fractal dimension D increased with the substrate temperature variation from 2.36 (at 473 K) to 2.66 (at 673 K) and then decreased to 2.33 (at 773 K). The fractal analysis in correlation with the averaged power spectral density (surface) yielded better quantitative results of morphological changes in the TiN thin films caused by substrate temperature variations, which were more precise, detailed, coherent and reproducible. It can be inferred that fractal analysis can be easily applied for the investigation of morphology evolution of different film/substrate interface phases obtained using different thin-film technologies.
URI: http://hdl.handle.net/20.500.12128/3319
DOI: 10.1515/msp-2015-0010
ISSN: 2083-1331
2083-134X
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