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Zastosuj identyfikator do podlinkowania lub zacytowania tej pozycji: http://hdl.handle.net/20.500.12128/440
Tytuł: New Class of Antimicrobial Agents: SBA-15 Silica Containing Anchored Copper Ions
Autor: Laskowski, Łukasz
Laskowska, Magdalena
Fijałkowski, Krzysztof
Piech, Henryk
Jelonkiewicz, Jerzy
Jaskulak, Marta
Gnatowski, Adam
Dulski, Mateusz
Słowa kluczowe: Copper; Copper compounds; Metal ions; Antimicrobial mechanisms; Silica
Data wydania: 2017
Źródło: Journal of Nanomaterials, Art. No. 1287698 (2017), s. 1-12
Abstrakt: The paper is about a new class of antimicrobial functional nanomaterials. Proposed compounds are based on SBA-15 porous silica matrices and contain anchored copper ions. Thanks to the immobilization of functional groups the compounds are safer for environment than commonly used disinfectant agents. We prepared and examined silica based materials containing two concentrations of copper-containing groups: 10 and 5%. For the reference we prepared samples containing free-standing CuO molecules in the structure and checked their antimicrobial properties. Antibacterial effect of considered SBA-15-Cu material was tested on Escherichia coli bacteria. Antimicrobial tests were applied for the pure form of the material and as modifying agents for plastics. The obtained results showed that the sample with lower concentration of active copper-containing groups has stronger antimicrobial properties than the one with higher concentration of copper. Interestingly, silica containing free-standing CuO molecules has no antimicrobial properties. Considering the obtained results, we can conclude that the most probable antimicrobial mechanism in this case is an oxidation stress. When a plastic modifier is applied the material is enriched with bacterial inhibitory properties. It seems that SBA-15 silica containing low concentration of anchored copper ions is promising in terms of its antibacterial property and biomaterial potential for commercial use.
URI: http://hdl.handle.net/20.500.12128/440
DOI: 10.1155/2017/1287698
ISSN: 1687-4110
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